1.  Hardware

mtr: 500        ;ICs, etc.
ce: 173.333
smd: 173.333
stm: 173.333
dii: 80
tii: 173.333
film: 300

2.  Software

spa: 80
pii: 2 * 173.333
tw: 173.333

3.  Manual

tw: 173.333
ce: 16          ;technical desc.
stm: 40         ;tech desc, review
spa: 16         ;tech desc
pii: 40         ;tech desc, review

4.  Capital Equipment

cap: 19000      ;microprocessor development system

