Flip Chips was Re: US Sources for old ICs

[Paul Koning]

>>>>> "Bob" == Bob Bradlee <Bob at BRADLEE.ORG> writes:

 Bob> On Wed, 26 Oct 2005 15:50:45 -0400, Tim Shoppa wrote:
 >> Brent wrote:
 >>> Across the history of ICs, DIP packaging begins to look like a
 >>> 25-to-30-year sidebar.

 >> I like the way "flip chip" (not just the term, but the concept) is
 >> coming back into vogue, forty years after DEC registered it as a
 >> trademark.

 >> Tim.

 Bob> From:
 Bob> http://tarr.uspto.gov/servlet/tarr?regser=serial&entry=72200706

 Bob> U.S. Class: 026 (International Class 009) ELECTRONIC CIRCUIT
 Bob> MODULES OF THE PLUGABLE TYPE, ...

 Bob> Is this an early description of what we know today as surface
 Bob> mount ?  or an early description of the Controlled Collapse Chip
 Bob> Connection, or C4 (C4) process used by Monolithic Systems
 Bob> Technology MST, introduced in 1968 formally by IBM ?

Certainly not surface mount.  I don't know the other things you
mention, but probably not.

"Flip Chip" as a DEC trademark simply designates the PC board with
stuff on them that implements some function and can be plugged into a
backplane.  Remember that DEC originally was in the logic modules
business -- the PDP-1 was its *second* product.

	 paul