Flip Chips was Re: US Sources for old ICs

[Bob Bradlee]

On Wed, 26 Oct 2005 15:50:45 -0400, Tim  Shoppa wrote:

>Brent wrote:
>> Across the history of ICs, DIP packaging begins to look like a
>> 25-to-30-year sidebar.

>I like the way "flip chip" (not just the term, but the concept) is coming
>back into vogue, forty years after DEC registered it as a trademark.

>Tim.

From: http://tarr.uspto.gov/servlet/tarr?regser=serial&entry=72200706

U.S. Class: 026 (International Class 009)
ELECTRONIC CIRCUIT MODULES OF THE PLUGABLE TYPE, CONTAINING ELECTRONIC COMPONENTS MOUNTED ON CIRCUIT BOARDS AND CONNECTED TO CONDUCTORS 
FORMED THEREON, AT LEAST ALL BUT ONE OF THE CONNECTIONS BETWEEN THE COMPONENTS AND CONDUCTORS BEING ON SURFACES OTHER THAN SURFACES OF 
SAID COMPONENTS CONTACTING THE BOARDS
First Use Date: 1964-08-24
Abandoned:  1987-03-06 

Is this an early description of what we know today as surface mount ?
or an early description of the Controlled Collapse Chip Connection, 
or C4 (C4) process used by Monolithic Systems Technology MST, 
introduced in 1968 formally by IBM ?

Some pictures of the inside of a MST chip can be found here.
http://www.ibm-collectables.com/gallery/view_album.php?set_albumName=album86

Sure looks like a modern flip-chip just way bigger in those days.

Good ideas can manifests themselves in many ways and applications.

Bob Bradlee